Laser Depaneling – If Thinking About a PCB Punching Machine, Then Peruse This Guide.

BEST Inc. provides laser depaneling services for printed circuit board manufacturers and also EMS and OEMs. BEST’s numerous lasers are equipped to handle volumes from small prototype to large production runs. Laser depaneling can cut through plastics, ceramics and metals or some combination thereof. It will be the right technique to use when there are sharp corners or many tight radii of curvature inside the PCB Router or perhaps in the flex circuit.

Depending on the material along with the part requirements, BEST laser services provides a tool-less part removal process in the form of final perforation, scoring and hold-in tabs. By using a laser to perform the depaneling allows the user the main advantage of speed and positional accuracy. Unlike mechanical methods there is not any part induced stresses, no tooling cost and no cutting oils or another contaminants.

rigid flex depanelizedIn addition BEST can be that provider of laser depanelization in case you have plenty of IoT devices which need to be precisely machined or cut out to match perfectly straight into small mechanical enclosures.

Due to the contact-free processing that goes on with Laser Depaneling of printed circuit boards, there is little distortion even when thin materials are being used. When boards are milled or punched out utilizing a mechanical tool there could show to be a loss precision and potentially a distortion in the outside board dimensions. Even worse it may well crack solder joints when you use these mechanical means. In BEST laser depanelization system feature fiducial registration and online scaling, which implies already existing distortions may be compensated as well as the cut contours positioned precisely within the layout.

Much like scoring or v-grooves, laser perforations are another choice for singulated board removal from a panel or sheet. Perforations could be laser formed for any size and spacing to meet the desired removal and securement forces.

Laser scoring can certainly produce a limited depth ablation line from the panelized boards. In most cases the depth in the score lines are 50% from the material thickness and will be controlled to a desired depth. The scoring acts within a manner just like the hold-tab to secure the part within the panel or sheet, but enables individual 19dexjpky to be ‘snapped’ out after processing. Laser scoring lines may also be used being a deliberate path for crack propagation or stress relief. When performing the score lines as a service BEST can either make use of the IPC guidelines or follow customer requirements.

Hold-in tabs are small uncut sections throughout the board which are utilized to secure the PCB Punching Machine within the panel. The hold-in tabs are used for comfort of handling small boards or printed circuit board securement for further processing. The hold-in tab width is chosen depending on the quantity of force desired to remove the part in the panel/sheet or known forces to get applied by downstream processes like component loading. BEST laser services can make tabs generally in most board materials and also to nearly any width and location about the part.